| 摘要 |
<p>PURPOSE: A coating apparatus for depositing an organic material on a semiconductor substrate is provided to control the thickness of the deposited organic material on the semiconductor substrate by controlling the volume of the organic material and the deposition time. CONSTITUTION: A sealed container(100) comprises a body portion and a lid part. A chuck(200) and a semiconductor substrate(300) are arranged inside the body portion of the sealed container. The chuck supports the semiconductor substrate. The chuck has the elasticity. The chuck is adhered closely to the over bottom of the semiconductor substrate. A pressure reducing unit(400) make the seal inside of container a vacuum condition. The low voltage transformer reduces the pressure of the sealed container to 4~5 Torr. The inlet unit(500) sprays liquid organic material on inside of the sealed container.</p> |
