| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit-component built-in substrate which forms a through-holes with satisfactory productivity and stably forms plating onto through-holes. <P>SOLUTION: The circuit-component built-in substrate includes a wiring substrate 101, a first insulating resin 102 formed on the wiring substrate 101, a plurality of circuit components 103, 104 having mutually different shapes and buried in the first insulating resin 102, and wiring formed on the first insulating resin 102. The plurality of circuit components are arranged with their surfaces at almost equal positions from the surface of the insulating resin, and are electrically connected to the wiring through vias formed in the insulating resin. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
