| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component such as a lead frame, terminal, connector, switch and relay in which cracks in a bent part and reduction in strength caused by thinning are prevented, and whose miniaturization is attained. SOLUTION: The electronic component is produced using a copper alloy sheet comprising 0.4 to 5% Ni, 0.1 to 1% Si and 0.01 to 10% Zn and/or 0.01 to 5% Sn, and the balance Cu with inevitable impurities, and, in which, in both the parallel and orthogonal directions to the rolling direction, proof stress is≥450 N/mm<SP>2</SP>, the ratio between the proof stress and tensile strength is≤0.95, and the ratio between uniform elongation and total elongation is≥0.5, and also, whose work hardening exponent (n value) is≥0.05. The copper alloy sheet has excellent bending workability in both the direcions of G. W. (the bending line orthogonal to the rolling direction) and B. W. (the bending line parallel to the rolling direction). COPYRIGHT: (C)2010,JPO&INPIT |
