WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. SOLUTION: The wiring board has a plurality of layers and includes an ink-jet wiring pattern 7 that is formed in a soluble porous membrane member 6' of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern 4 that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate 2. Another layer among the plurality of layers is a porous membrane treated member layer 6 including a porous membrane member 6' at one part of a region of the other layer. The ink-jet wiring pattern 7 is formed in the porous membrane treated member layer 6. The transferred wiring pattern 4 is formed in the substrate 2. COPYRIGHT: (C)2010,JPO&INPIT