| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a frequency adjustment apparatus which can simultaneously perform frequency adjustments of a plurality of elements in good precision, for wafers with many elements closely arranged. Ž<P>SOLUTION: The wafers 10 on which the plurality of the elements are closely arranged are irradiated with ion beams while being conveyed in one direction by a conveying means. Each of shutters adjusts an irradiation time of the ion beams for a target area. Thus a frequency of the target area is adjusted. While a plurality of mask holes 15a, 15b in a pattern mask 15 disposed between the shutters 14a, 14b and the wafers 10, are independently prepared for each area, the mask holes are disposed in a perpendicular direction of a wafer conveying direction, in multiple columns, and alternately shifting in the wafer conveying direction. In order to individually open and close the mask holes, the shutters 14a, 14b are disposed corresponding to the respective mask holes. The frequency adjustment for areas 10a in one column of a direction perpendicular to the wafer conveying direction, is performed in multiple steps. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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