| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of encapsulating a microelectronic device by a getter material. <P>SOLUTION: The method of encapsulating the microelectronic device 100 arranged on a substrate 102, includes the steps of: (a) formation of a portion of a sacrificial material covering at least one part of the microelectronic device 100, the volume of which occupies a space intended to form at least one part of a cavity 114 in which the device 100 is intended to be encapsulated; (b) deposition of a layer 108 based on at least one getter material, covering at least one part of the portion of sacrificial material; (c) formation of at least one orifice 112 through at least the layer 108 of the getter material, forming an access to the portion of sacrificial material; (d) elimination of the portion of sacrificial material via the opening 112, forming the cavity 114 in which the microelectronic device 100 is encapsulated; and (e) sealing of the cavity 114. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
