| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which prevents breakage of a mounted part by rapid volume expansion of absorbed moisture and suppresses loads to bonded parts of the semiconductor device. SOLUTION: The semiconductor device is constructed such that a semiconductor chip 1 and a circuit board 3 are electrically connected via bumps 2 formed on the electrodes of the semiconductor chip 1 and via wiring 4 formed on the circuit board 3, while a sealing resin 5 is interposed between the semiconductor chip 1 and the circuit board 3. A structure capable of reducing stresses caused by the absorbed moisture contained in the sealing resin 5 is constructed by through-holes 21 formed in the circuit board 3, wherein the through-holes 21 are positioned at corners of the semiconductor-chip mounted region 3a of the circuit board 3. COPYRIGHT: (C)2010,JPO&INPIT
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