| 摘要 |
PROBLEM TO BE SOLVED: To provide a scratch detection apparatus for a wafer and a grinder equipped with the scratch detection device. SOLUTION: The grinder includes a chuck table for holding a wafer and a grinding means having a grinding wheel for grinding the wafer held on the chuck table. The grinder further includes a scratch detection means for detecting a scratch produced on a ground surface of the wafer. The scratch detection means includes an oblique light beam irradiation means for obliquely irradiating the wafer onto a region corresponding to a radius of the wafer with a light beam, a line scan lens for forming an image of the region corresponding to the radius of the wafer, a line scan camera for photographing the image formed by the line scan lens, and a scratch determination means for determining presence/absence of the scratch based on the image photographed by the line scan camera, and detects the scratch during at least one revolution of the chuck table. COPYRIGHT: (C)2010,JPO&INPIT
|
