| 摘要 |
PURPOSE: A multilayer circuit board is provided to facilitate repair/maintenance of a transmission/reception module by replacing a device or circuit of the transmission/reception module after completing the transmission/reception module. CONSTITUTION: A plurality of receiving holes are formed to pass through both sides of a circuit board(103). A ground pattern is formed on one side of the circuit board. The ground pattern is opposite to the high frequency circuit board to shield electrical connection between the high frequency circuit board and the circuit board. The ground pattern has an open region corresponding to a signal wiring(127). A plurality of integrated circuit chips are mounted on one side of the high frequency circuit board. The signal wiring is formed on the high frequency circuit board to transmit the signal between the plurality of integrated circuit chips.
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