发明名称 LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting device which increases adhesion of a lead frame and a package, prevents interface delamination between the lead frame and package, prevents discoloration of the package by light from a light-emitting element, and effectively radiates heat generated from the light-emitting element. <P>SOLUTION: The light-emitting device includes the package provided with an opening part having a side surface and bottom surface, and the lead frame exposed from the bottom surface of the opening part. The lead frame includes a bent reflection part on the side surface of the opening part, and part of an inner wall surface of the reflection part is positioned inside the package. The present invention increases the adhesion of the lead frame and package to prevent the interface delamination between the lead frame and package, and at the same time, the discoloration of the package by the light from the light-emitting element is prevented, and the heat generated from the light-emitting element is effectively radiated. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010034325(A) 申请公布日期 2010.02.12
申请号 JP20080195484 申请日期 2008.07.29
申请人 NICHIA CORP 发明人 KANEDA MORIHITO;ASAKAWA HIDEO
分类号 H01L33/48 主分类号 H01L33/48
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