发明名称 PRINT PROCESSING FOR PATTERNED CONDUCTOR, SEMICONDUCTOR AND DIELECTRIC MATERIALS
摘要 <p>Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.</p>
申请公布号 KR20100016173(A) 申请公布日期 2010.02.12
申请号 KR20097022967 申请日期 2008.05.03
申请人 KOVIO, INC. 发明人 SCHER ERIK;KAMATH ARVIND;ROCKENBERGER JOERG;MORI IKUO;MOLESA STEVEN
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
主权项
地址