发明名称 |
METHOD FOR CLEANING SEMICONDUCTOR WAFER SURFACES BY APPLYING PERIODIC SHEAR STRESS TO THE CLEANING SOLUTION |
摘要 |
<p>Systems and methods for cleaning particulate contaminants adhered to wafer surfaces are provided. A cleaning media including dispersed coupling elements suspended within the cleaning media is applied over a wafer surface. External energy is applied to the cleaning media to generate periodic shear stresses within the media. The periodic shear stresses impart momentum and/or drag forces on the coupling elements causing the coupling elements to interact with the particulate contaminants to remove the particulate contaminants from the wafer surfaces.</p> |
申请公布号 |
KR20100016111(A) |
申请公布日期 |
2010.02.12 |
申请号 |
KR20097022818 |
申请日期 |
2008.03.27 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
FREER ERIK M.;DE LARIOS JOHN M.;RAVKIN MICHAEL;KOROLIK MIKHAIL;REDEKER FRITZ C. |
分类号 |
H01L21/302;H01L21/304 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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