MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD

摘要

PURPOSE: A manufacturing method for a printed circuit board is provided to offer a circuit pattern with a superior electric conductivity by welding reliably without processing additional surface process on the substrate. CONSTITUTION: A substrate(S100) is provided. A first conductive ink is printed on a substrate and a first circuit pattern is formed(S200). A second conductive ink is printed on the first circuit pattern and a second circuit pattern is formed(S300). The weight ratio of the organic additive for the metal particle in the first conductive ink is higher than the weight ratio of the organic additive for the metal particle in the second conductive ink.