| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that although a powdery resin is casted in a cavity before metal molds are clamped so as to form a sealing body by a compression molding system, the resin casted in the cavity begins to be cured under an influence of heat of the metal molds which are normally heated/held at a temperature for sealing, and the powdery resin also begins to be cured as well even when supplied onto a film in advance. <P>SOLUTION: A method of manufacturing a semiconductor device in which a plurality of semiconductor chips on an organic wiring board are sealed with a resin in a batch sealing manner by a compression molding method using a molding metal mold having upper and lower metal molds, includes supplying a resin material for sealing onto a mold release film in advance, and then setting a part of the mold release film having been supplied with the resin material for sealing in the lower mold in a state where the interval between the upper and lower metal molds is made narrow. <P>COPYRIGHT: (C)2010,JPO&INPIT |
