发明名称 |
METHOD OF DESIGNING MASK PATTERN SET, MASK PATTERN SET, AND METHOD OF MANUFACTURING DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of forming a feature of a critical dimension smaller than a limit of a single exposure step. <P>SOLUTION: A multiple-exposure lithographic process in which a developed resist pattern derived from a first exposure is present within a second resist layer that is exposed in a second exposure of the multiple-exposure lithographic process. A second mask pattern used in a second exposure process includes at least one localized adjustment to at least one feature thereof to compensate for scattering effects of the developed resist pattern that is present when the second exposure is performed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010034554(A) |
申请公布日期 |
2010.02.12 |
申请号 |
JP20090168334 |
申请日期 |
2009.07.17 |
申请人 |
ASML NETHERLANDS BV |
发明人 |
DE PUTTER SANDER;FINDERS JOZEF MARIA;VLEEMING BERTUS JOHAN |
分类号 |
H01L21/027;G03F1/08 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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