发明名称 |
POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN |
摘要 |
PURPOSE: A method for forming resist pattern is provided to form a resist pattern with high resolution and good shape with little influence on the first resist pattern in a double patterning process. CONSTITUTION: A positive resist composition comprises: a base component(A) which exhibits increased solubility in an alkali developing solution under the action of acid; and an acid-generator component(B) which generates acid upon exposure; and an organic solvent(S), wherein the organic solvent(S) comprises an alcohol-based organic solvent having a boiling point of at least 150deg.C. A method for forming a positive resist pattern comprises: applying a positive resist composition to a substrate to form a first resist film on the substrate; subjecting the first resist film to selective exposure and alkali developing to form a first resist pattern; applying a positive resist composition on the substrate on which the first resist pattern is formed to form a second resist film; and subjecting the second resist film to selective exposure and alkali developing to form a resist pattern. |
申请公布号 |
KR20100015288(A) |
申请公布日期 |
2010.02.12 |
申请号 |
KR20090070879 |
申请日期 |
2009.07.31 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
TAKESHITA MASARU;KUMADA SHINJI;YOSHII YASUHIRO;IWAI TAKESHI;NAKAMURA TSUYOSHI |
分类号 |
G03F7/039 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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