| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device for preventing the degradation in breakdown voltage due to the occurrence of cracks in an insulating layer coating the circuit board, even in the condition in which the thrust of screw fitting acts on the circuit board. SOLUTION: A hybrid integrated circuit device 10 has such a configuration as to have a circuit board 18 with a hybrid integrated circuit composed of a conductive pattern 22 and a semiconductor device 24 and built in the upper surface, a case material 12 having a frame-like shape and forming a region for sealing the hybrid integrated circuit by abutting against the circuit board 18, and a sealing resin 16 that is filled in the region surrounded by the case material 12 to seal the hybrid integrated circuit. Moreover, the hybrid integrated circuit device 10 is provided with a removal region 32 by partially removing an insulating layer 20 in the periphery of a through-hole 34 penetrating the circuit board 18, so as to suppress the progress of the crack by this removal region 32. COPYRIGHT: (C)2010,JPO&INPIT |
