METHOD OF MANUFACTURING MOUNTING STRUCTURE, METHOD OF MANUFACTURING ELECTRO-OPTICAL DEVICE, AND ELECTRO-OPTICAL DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a mounting structure allowing mounting of a semiconductor device on a substrate without leaving large stress on the substrate; a method of manufacturing an electro-optical device; and an electro-optical device.

SOLUTION: The method of manufacturing an electro-optical device 100 executes: a first step ST1 of heating a thermosetting resin included in an anisotropic conductive film 91 to a temperature above a setting temperature while pressurizing an IC chip 40 by a press-bonding head 60 when mounting the IC chip 40 on an element substrate 10; a second step ST2 of cooling the thermosetting resin; and a third step ST3 of heating a resin layer to a temperature without exceeding a glass transition temperature again. Accordingly, stress remaining in the element substrate 10 in a stage in which the second step ST2 has been finished can be eliminated in the third step ST3.

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