| 摘要 |
PROBLEM TO BE SOLVED: To relax swelling of a multilayer wiring board by thermal hysteresis such as a reflow process of component mounting and to suppress deterioration of yield by improvement of laser via workability in a method of manufacturing the multilayer wiring board by an additive method. SOLUTION: The method of manufacturing the multilayer wiring board, which combines a conductor circuit with an insulating resin layer, includes (1) a process for laminating and thermocompression-bonding a conductor circuit face of a circuit board with the conductor circuit formed thereon and an insulating resin face of an insulating resin sheet with carrier film so that they confront each other, (2) a process for thermally treating the sheet by attaching the carrier film of the insulating rein sheet with carrier film as it is and making a curing degree of insulating resin to be 80% to 95%, (3) a process for forming a via hole by irradiating an insulating resin with laser, (4) a process for curing the insulating resin by performing heat treatment. COPYRIGHT: (C)2010,JPO&INPIT |
