| 摘要 |
[PROBLEMS]To provide a method for manufacturing a chip with adhesive, in which the need for pushing up the chip is eliminated while involving such pick up as the holding force of a chip not yet picked up does not vary as the pick up progresses.[MEANS FOR SOLVING PROBLEMS]Under a state where a die bond adhesive layer (24) and a wafer (1) are laminated on the adhesion layer (31) of a fixed jig (3), a chip (13) is formed by cutting the wafer (1) and the die bond adhesive layer (24) completely and then the chip (13) is picked up from the fixed jig (3) together with the die bond adhesive layer (24) by deforming the adhesion layer (31) of thefixed jig (3). In such a method for manufacturing a chip with adhesive, the fixed jig (3) has the adhesion layer (31) and a jig base (30), which has a plurality of protrusions on one side and a sidewall (35), on the outer circumference thereof. The adhesion layer (31) is laminated on the surface of the jig base (30) provided with the protrusions and bonded on the upper surface of the sidewall (35). On the surface of the jig base (30) provided with the protrusions, a partitioned space (37) is formed by the adhesion layer (31), the protrusions and the sidewall (35). The jig base (30) is provided with at least one through hole (38) penetrating the outside and the partitioned space (37), and the adhesion layer (31) can be deformed by sucking air in the partitioned space (37) via the through hole (38) of the fixed jig (3). |
