| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly sensitive photosensitive resin composition having excellent image resolution, thermal stability, chemical resistance and solvent solubility, and capable of preventing tightness to a substrate from getting worse after a pressure cooker test. <P>SOLUTION: The photosensitive resin composition for an MEMS contains a cationic photopolymerization initiator (A) and an epoxy resin (B) having two or more epoxy groups in one molecule, and the cationic photopolymerization initiator (A) is expressed by Formula (1). <P>COPYRIGHT: (C)2010,JPO&INPIT |
