| 摘要 |
Disclosed is a polyimide precursor composition solution which can be cured at a low temperature (at 250°C or less) without using a siloxane diamine. This polyimide precursor composition solution has low viscosity even at high concentration. Also disclosed are a photosensitive resin composition obtained from such a polyimide precursor composition solution and having good physical properties, a photosensitive resin film, a thermosetting resin composition, a polyimide insulating film and a printed wiring board with insulating film. Specifically disclosed is a polyimide precursor composition solution containing at least (A) a urethane imide oligomer having a terminal carboxylic acid group and (B) a diamine compound and/or an isocyanate compound.
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