发明名称 ELECTRONIC COMPONENT MOUNTER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounter selecting a sucking means such as a suction nozzle and setting a mounting operation in accordance with the weight of each electronic component as well as the profile or size of each electronic component to be sucked and mounted. <P>SOLUTION: A self weight receiving spring 5 cancels the weight of a suction mechanism portion freely vertically movable. A load cell 7 detects the magnitude of a pressure. A pressurizing spring 6 gives a pressure corresponding to a vertical movement quantity of the suction mechanism to the load cell 7. As described above, a mechanism unit for measuring the weight of the electronic component 1 sucked by the suction nozzle 2 is configured, and the weight of the electronic component 1 sucked by the suction nozzle 2 is measured based on the magnitude of the pressure detected by the load cell 7. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010034095(A) 申请公布日期 2010.02.12
申请号 JP20080191426 申请日期 2008.07.24
申请人 JUKI CORP 发明人 SHINDO ATSUHIKO;IWASAKI NOZOMI;IWASE ATSUSHI
分类号 H05K13/04 主分类号 H05K13/04
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