| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board capable of preventing the generation of a stress. SOLUTION: The printed wiring board 11 includes a core substrate 12 containing carbon fiber and having rigidity for maintaining its shape with a single unit. A buildup layer 26 or 27 is formed on the core substrate 12. The buildup layer 26 or 27 has insulation layers 28 and conductive wiring layers 29 which are sequentially laminated and in which rigidity for maintaining the shape with a single unit depends on the core substrate 12. The insulation layer 28 is formed of a fiber 37 and a resin material impregnated into the fiber 37. In the buildup layer 26 or 27, a thermal expansion coefficient is suppressed low based on the fiber 37. In the core substrate 12, the thermal expansion coefficient is also suppressed low based on the carbon fiber. Accordingly, the thermal expansion coefficient of the buildup layer 26 or 27 is adjusted to match the thermal expansion coefficient of the core substrate 12. The generation of stress is prevented in the printed wiring board 11. The generation of cracks in the buildup layer 26 or 27 can be prevented. The disconnection of a conductive wiring layer 29 can be prevented. COPYRIGHT: (C)2010,JPO&INPIT |
