| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an optically coupled semiconductor relay which increases or reduces a pitch between terminals as compared with an existing one by diverting a conventional facility. <P>SOLUTION: An optically coupled molded body 10 is formed by oppositely arranging a light-emitting element 13 arranged on a light emission side internal lead frame 11 and a light-receiving element 14 arranged on a light-receiving side internal lead frame 12 and integrally molding these elements with a translucent resin 17. The light-emitting side internal lead frame and light-receiving side internal lead frame 11, 12, which project to an outside of the optically coupled molded body 10, are respectively joined to a light-emitting side and light-receiving side external lead frames 21, 22. The optically coupled molded body 10 and joined parts 31, 32 of the lead frames are integrally molded with a light-shielding resin 18 and are covered with an outside molded body 20. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
