摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer burn-in substrate structure having a power supply tower. Ž<P>SOLUTION: A plurality of power supply towers are mounted on a multilayer substrate, a pin of each power supply tower is inserted into a multilayer substrate and electrically connected to a power supply layer of it, and two power supply towers connected to the same power supply layer are further interconnected through a power supply line. A screw hole is disposed in each power supply tower, a terminal is disposed at one end of each power supply line, and thus the power supply towers and the power supply lines are electrically interconnected by fixing the terminals to the screw holes of the power supply towers with screws. Therefore, even if one power supply line breaks among them, the screw is promptly removed and the breaking power supply line can be replaced by a new power supply line, and the labor and cost can be saved. Additionally, by coating the power supply line surfaces with a glass coating layer, the power supply lines are further protected, high temperature oxidation in a burn-in process of a chip or short circuit can be prevented. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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