| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a developing processing method and a developing processing apparatus, shortening the cleaning and drying time and removing flaws of drying stripes. Ž<P>SOLUTION: In a developing processing method that supplies pure water on a surface of a semiconductor wafer W to carry out cleaning after supplying a developing liquid on the surface of the exposed wafer to carry out development, the pure water is supplied from a rinse nozzle 58 from an upper part of the center part of the wafer while rotating a spin chuck which holds the wafer horizontally around a vertical axis. At the same time, air current A generated by the rotation of the wafer is introduced and diffused onto a liquid film F of the pure water by a diffuser 53 adjacent to the rinse nozzle. The rinse nozzle and the diffuser are put in a parallel state, and are simultaneously moved in a diameter direction from the center part of the wafer toward an outer peripheral edge of the wafer, and cleaning and drying of the wafer are carried out. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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