IC HAVING VIABAR INTERCONNECTION AND RELATED METHOD
摘要
<p>An IC including first metal layer having wiring running in a first direction; a second metal layer having wiring running in a second direction perpendicular to the first direction; and a first via layer between the first metal layer and the second metal layer, the first via layer including a viabar interconnecting the first metal layer to the second metal layer at a first location where the first metal layer vertically coincides with the second metal layer and, at a second location, connecting to wiring of the first metal layer but not wiring of the second metal layer.</p>
申请公布号
WO2010017010(A1)
申请公布日期
2010.02.11
申请号
WO2009US50919
申请日期
2009.07.17
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION;CHIDAMBARRAO, DURESETI;GRECO, STEPHEN, E.;LOW, KIA, S.
发明人
CHIDAMBARRAO, DURESETI;GRECO, STEPHEN, E.;LOW, KIA, S.