发明名称 THERMALLY CONDUCTIVE MODULE
摘要 A thermally conductive module includes a base seat, a thermally conductive copper block and a heat pipe. A side face of the base seat is arranged an accommodation slot, a lateral side of which is arranged a fixing slot. The thermally conductive copper seat is inset into the fixing slot and combined therewith. The heat pipe has a heated section, on which a plane is configured and flush with the side face of the base seat, and which is accommodated by being clamped between the accommodation slot and the thermally conductive copper block. Thus, it is possible to effectively boost the thermally conductive speed and thermally conductive performance entirely.
申请公布号 US2010032137(A1) 申请公布日期 2010.02.11
申请号 US20090510811 申请日期 2009.07.28
申请人 HUANG SHIH-WEI;HSIEH YI-JEN 发明人 HUANG SHIH-WEI;HSIEH YI-JEN
分类号 F28D15/02;F28F7/00 主分类号 F28D15/02
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