发明名称 THERMALLY CONDUCTIVE POLYESTER MOLDING MATERIALS
摘要 Thermoplastic molding compositions comprising A) from 10 to 69% by weight of a thermoplastic polyester B) from 30 to 79% by weight of an aluminum oxide C) from 0.01 to 10% by weight of an organic or inorganic acid or mixture of these D) from 0 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these E) from 0 to 50% by weight of other additives, where the entirety of the percentages by weight of components A) to E) gives 100%.
申请公布号 US2010032611(A1) 申请公布日期 2010.02.11
申请号 US20070445118 申请日期 2007.10.02
申请人 BASF SE 发明人 FUKUHARA HIROKI;EIPPER ANDREAS;WEISS CARSTEN;VOELKEL MARK;STRANSKY REINHARD;ASSMANN JENS;WEBER MARTIN
分类号 C09K3/18 主分类号 C09K3/18
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