发明名称 |
Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit |
摘要 |
A suspension board with circuit includes a metal supporting board, a conductive layer laminated on the metal supporting board, and a via layer interposed between the metal supporting board and the conductive layer. The conductive layer includes a conductive pattern, and a reference portion serving as a positioning reference for placing the suspension board with circuit on a load beam.
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申请公布号 |
US2010032201(A1) |
申请公布日期 |
2010.02.11 |
申请号 |
US20090458996 |
申请日期 |
2009.07.29 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
OOYABU YASUNARI;OHSAWA TETSUYA;TANI EMIKO |
分类号 |
H05K1/02;B32B38/00;C23F1/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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