发明名称 HOLLOW STRUCTURE FORMING SUBSTRATE, METHOD OF PRODUCING HOLLOW STRUCTURE FORMING SUBSTRATE, AND METHOD OF PRODUCING HOLLOW STRUCTURE USING HOLLOW STRUCTURE FORMING SUBSTRATE
摘要 A hollow structure forming substrate includes: a surface on which a plastic-deformation film is formed by using a plastic-deformable material; a plurality of regularly-arranged gas-retaining spaces; a plurality of gas leading-out parts each having a first opening which faces corresponding one of the gas-retaining spaces and a second opening which faces the surface, the gas leading-out parts leads out gas retained in the gas-retaining spaces toward the surface under depressurized environmental condition; and a plurality of infiltration preventing spaces each provided in a space between corresponding one of the first openings and corresponding one of the second openings, in which the infiltration preventing spaces prevent infiltration of the plastic-deformable material from the surface into the gas-retaining spaces.
申请公布号 US2010035040(A1) 申请公布日期 2010.02.11
申请号 US20080518981 申请日期 2008.01.10
申请人 MASUZAWA MASAHIRO;OHGAKI MASARU 发明人 MASUZAWA MASAHIRO;OHGAKI MASARU
分类号 B32B3/26;B28B7/16;B28B7/38;B29D22/00 主分类号 B32B3/26
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