METHOD FOR MANUFACTURING FLEXIBLE SEMICONDUCTOR DEVICE

摘要

Provided is a method for manufacturing a flexible semiconductor device.  The manufacturing method is characterized by comprising (i) a step of forming an insulating film on the upper surface of a resin film, (ii) a step of forming an extraction electrode pattern on the upper surface of the resin film, (iii) a step of forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the extraction electrode pattern, and (iv) a step of forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, wherein at least one forming step among the above (i) to (iv) is performed by a printing method.  In the manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.