ETCHANT FOR COPPER OR COPPER ALLOY MATERIAL, PRE-PLATING TREATMENT METHOD, AND METHOD FOR FORMING MEMBER FOR ELECTRONIC COMPONENT

摘要

Disclosed is a method for forming a member for electronic components, which comprises an etching step wherein etching is carried out using an etchant for copper or copper alloy materials which is mainly composed of a copper (II) ion source, a halogen ion source and an organic acid, and a plating step wherein a tin or tin alloy plating film is formed on a copper or copper alloy material roughened in the etching step.  Consequently, whiskers to be generated on the tin or tin alloy plating film are suppressed, thereby maintaining the performance of a resulting product and reliability thereof for connection and the like.