| 摘要 |
<p>A mutual connection structure between multi-layer baseboards and manufacturing method thereof are provided. The structure includes a first multi-layer baseboard (300) and a second multi-layer baseboard (400). The first multi-layer baseboard has a first metal layer (11), a first dielectric layer (13) and a hole (1,2,3). The end edge of the first metal layer is connected to that of the corresponding first dielectric layer, and separated from the end edge of the other adjacent first metal layers (14,17) and dielectric layers (16,19). The second multi-layer baseboard has a second metal layer (21) and a second dielectric layer (23). The end edge of the second metal layer is connected to that of the corresponding second dielectric layer, and separated from the end edge of the other adjacent second metal layers (24,27) and dielectric layers (26,29). The hole are formed on the end of the first dielectric layer of the first multi-layer baseboard, and have a conductive portion therein. The conductive portion of the first metal layer is bonded to the second metal layer of the second multi-layer baseboard.</p> |
