发明名称 MICROSCALE COOLING APPARATUS AND METHOD
摘要 A method and system for providing a heat sink assembly are described. The assembly includes a two-phase heat sink, a condenser, and a pump. The two-phase heat sink may include flow micro-channels that accommodate the flow of boiling coolant and cross-connect channel(s) that at least partially equilibrate a pressure field for the boiling coolant. The condenser receives coolant from the heat sink and removes heat. The pump drives coolant through the assembly. In one aspect, the assembly is a closed system for the coolant. In another aspect, the condenser includes first and second plates and a heat exchange surface there between. Coolant flows from the heat sink and through the plates. The gaseous coolant passes the heat exchange surface. In one aspect the gaseous coolant flows opposite to the direction coolant flows. In one aspect, at least one of the plates includes dummy channel(s) for insulating part of the plate(s).
申请公布号 US2010032150(A1) 申请公布日期 2010.02.11
申请号 US20090511945 申请日期 2009.07.29
申请人 PIPELINE MICRO, INC. 发明人 DETERMAN MATTHEW;LEE SCOTT W.C.H.;SIU HO ABEL MANUEL;LEE SERI
分类号 F28F27/00;F28D15/02;F28F7/00 主分类号 F28F27/00
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