| 摘要 |
A wiring substrate of the invention comprises electrical insulation substrate (1), through-hole (3) formed in the electrical insulation substrate, electrically conductive paste (4) filled inside the through-hole, and wiring traces (11) formed on one or both surfaces of the electrical insulation substrate and electrically connected with the electrically conductive paste, wherein interfaces of the wiring traces in contact with the electrically conductive paste have at least one of an asperate surface and a smooth surface, and a plurality of granular bumps (14) formed further thereon.
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