发明名称 |
POLISHING WITH ENHANCED UNIFORMITY |
摘要 |
A polishing head is presented. The polishing head includes a housing having top and bottom surfaces. The housing is formed from a single piece of material. The polishing head includes grooves disposed on the bottom surface and an inlet in communication with the grooves for coupling to a pressure medium supply to supply a pressure medium to the grooves. The pressure medium when supplied to the grooves exerts pressure on a template when attached to the bottom surface to provide back side pressure on a back surface of an article when temporally attached to the template.
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申请公布号 |
US2010035527(A1) |
申请公布日期 |
2010.02.11 |
申请号 |
US20080188226 |
申请日期 |
2008.08.08 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
JINDAL SUNIL KUMAR;GUPTA ARUN KUMAR |
分类号 |
B24C5/04 |
主分类号 |
B24C5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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