发明名称 POLISHING WITH ENHANCED UNIFORMITY
摘要 A polishing head is presented. The polishing head includes a housing having top and bottom surfaces. The housing is formed from a single piece of material. The polishing head includes grooves disposed on the bottom surface and an inlet in communication with the grooves for coupling to a pressure medium supply to supply a pressure medium to the grooves. The pressure medium when supplied to the grooves exerts pressure on a template when attached to the bottom surface to provide back side pressure on a back surface of an article when temporally attached to the template.
申请公布号 US2010035527(A1) 申请公布日期 2010.02.11
申请号 US20080188226 申请日期 2008.08.08
申请人 CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. 发明人 JINDAL SUNIL KUMAR;GUPTA ARUN KUMAR
分类号 B24C5/04 主分类号 B24C5/04
代理机构 代理人
主权项
地址