SENSOR DEVICE AND METHOD FOR MANUFACTURE

摘要

A sensor device is provided, comprising a ceramic support substrate (1), wherein at least two conduction paths (2a, 2b) are disposed on the support substrate (1). The sensor device comprises at least one ceramic component in the form of a chip that is connected to the conduction paths (2a, 2b) in an electrically conducting manner. The at least one ceramic component is mechanically connected to the conduction paths (2a, 2b) by way of a burnt-in screen printing paste.