发明名称 HEAT TREATING DEVICE AND HEAT TREATING METHOD
摘要 <p>A heat treating device is provided with a closed container (1), a processing space (20) provided in the closed container (1) and capable of containing a substrate (5), heaters (21, 22) arranged in the closed container (1) so as to face the processing space (20), and a shower head (10) provided inside the closed container (1) and having a gas introducing hole (15) and gas ejecting holes (31), the gas introducing hole (15) being adapted such that gas inactive to the substrate (5) and heating and cooling the substrate (5) is introduced into the gas introducing hole (15), the gas ejecting holes (31) being arranged facing the substrate (5) and ejecting the gas, which is introduced into the shower head (10) through the gas introducing hole (15), toward the substrate (5).  A dispersing plate (17) is provided in the shower head (10), and the dispersing plate (17) partitions the inside of the shower head (10) into an upstream chamber (13) on the gas introducing hole (15) side and a downstream chamber (14) on the gas ejecting hole (31) side.  The dispersing plate (17) has formed therein through-holes (32) for interconnecting the upstream chamber (13) and the downstream chamber (14).</p>
申请公布号 WO2010016421(A1) 申请公布日期 2010.02.11
申请号 WO2009JP63555 申请日期 2009.07.30
申请人 SHIBAURA MECHATRONICS CORPORATION;TAKAHASHI, KIYOSHI 发明人 TAKAHASHI, KIYOSHI
分类号 F27D7/02;C03B32/00;F27B17/00;F27D7/06;F27D9/00;F27D11/02 主分类号 F27D7/02
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