| 摘要 |
A silent cooling apparatus for effectively reducing the operating temperature of an electronic device includes a plurality of components which include surfaces opposite to each other with a spacing therebetween and have a heat generating spot on at least any of the surfaces opposite to each other, in a small and low-cost configuration. The apparatus for cooling a heat generating spot of an electronic device includes a cooling apparatus for forcedly air-cooling a heat generating spot of an electronic device which includes a plurality of components which are disposed side by side to have the same in-plane direction, and include heat generating spots within their surfaces. The cooling apparatus includes a first air cooling unit for feeding an air stream to the heat generating spot in an orientation of the in-plane direction, and a second air cooling unit for feeding an air stream to the heat generating spot in the in-plane direction in a different orientation from the air stream by the first air cooling unit.
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