| 摘要 |
<p>Provided is a printed-circuit board (1) comprising a resin substrate (10) as a first insulating layer, a conductor circuit (20) formed over the resin substrate (10), a resin insulating layer (30) having a first face (30a) on the side of the conductor circuit (20), a second face (30b) disposed on the side opposite to the first face (30a) and exposed to the outside, and a via hole (31) formed for the via conductor, a plurality of pads (40) each having a via land (41) formed over the second face (30b) of the resin insulating layer (30), and a via conductor (42) filling the via hole (31), a metal film (50) formed in at least portions of the upper face and the side face of each of the pads (40), and a solder bump (60) formed over the metal film (50). As a result, electronic parts can be held in sufficient junction strength while suppressing the occurrence of the Manhattan phenomena.</p> |
