| 摘要 |
A light-emitting module (1) includes: a package (10); a base board (13) and a semiconductor multi-layered film (50) accommodated in the package (10); and a plurality of terminal portions (16) for supplying electricity to the semiconductor multi-layered film (50), wherein the package (10) includes a metallic support portion (11b) supporting the base board (13), a plurality of through-holes (11c) for insertion of the respective terminal portions (16), an insulating member (11d) keeping electrical insulation between the metallic support portion (11b) and the terminal portions (16), and between the respective terminal portions (16), and a window portion (12a); the base board (13) is made of an inorganic heat-dissipating material that keeps electrical insulation between the semiconductor multi-layered film (50) and the metallic support portion (11b); and one opening of each of the through-holes (11c) is provided on a side surface of the package (10). Because of this, a light-emitting module is provided, which can keep heat dissipation and has high heat resistance and light stability.
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