发明名称 PHOTORESIST COMPOSITION
摘要 <p>The present application relates to a composition comprising a) a polymer containing an acid labile group; b) a compound selected from (i), (ii) and mixtures thereof, where (i) is Ai Xi Bi and (ii) is Ai Xi 1; and c) a compound of formula Ai Xi2 where Ai, Bi, Xi, Xi1, and Xi2 are defined herein. The compositions are useful in the semiconductor industry.</p>
申请公布号 KR20100014919(A) 申请公布日期 2010.02.11
申请号 KR20097018602 申请日期 2008.02.06
申请人 AZ ELECTRONIC MATERIALS USA CORP. 发明人 PADMANABAN MUNIRATHNA;CHAKRAPANI SRINIVASAN
分类号 G03F7/004;G03F7/039 主分类号 G03F7/004
代理机构 代理人
主权项
地址