ADHESIVE COMPOSITION FOR ATTACHING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE: An adhesive composition for attaching semiconductor chips is provided to ensure excellent workability and reliability and to be used for attaching semiconductor chips required for high reliability. CONSTITUTION: An adhesive composition for attaching semiconductor chips comprises epoxy resin, hardener, curing accelerator and inorganic filler. The inorganic filler comprises silicon powder in the amount of 30-70 weight% based on the whole adhesive composition. The average particle size of silicon powder is 0.1~20 micron. The epoxy resin is a bisphenol-based epoxy resin represented by chemical formula 1. In chemical formula 1, R is independently hydrogen or C1-6 alkyl group.