Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same

摘要

The silica film forming material of the present invention comprises a silicone polymer which comprises, as part of its structure, CHx, an Si-O-Si bond, an Si-CH3 bond and an Si-CHx- bond, where x represents an integer of 0 to 2.