发明名称 Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same
摘要 A test socket includes a socket body in which a semiconductor package is located, a socket head combined with the socket body, a Peltier element in the socket head, and power terminals connected to the Peltier element. A test equipment includes the test socket and a method of testing the semiconductor package uses the test socket.
申请公布号 US7659738(B2) 申请公布日期 2010.02.09
申请号 US20080017202 申请日期 2008.01.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG JUN-PYO
分类号 G01R31/02 主分类号 G01R31/02
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