发明名称 Removal of silicon oxycarbide from substrates
摘要 A method of treating a substrate comprises depositing silicon oxycarbide on the substrate and removing the silicon oxycarbide from the substrate. The silicon oxycarbide on the substrate is decarbonized by exposure to an energized oxygen-containing gas that heats the substrate and converts the layer of silicon oxycarbide into a layer of silicon oxide. The silicon oxide is removed by exposure to a plasma of fluorine-containing process gas. Alternatively, the remaining silicon oxide can be removed by a fluorine-containing acidic bath. In yet another version, a plasma of a fluorine-containing gas and an oxygen-containing gas is energized to remove the silicon oxycarbide from the substrate.
申请公布号 US7659206(B2) 申请公布日期 2010.02.09
申请号 US20060359301 申请日期 2006.02.21
申请人 APPLIED MATERIALS, INC. 发明人 VEPA KRISHNA;BHATNAGAR YASHRAJ;RAYANDAYAN RONALD;BALAGANI VENKATA
分类号 H01L21/3105;H01L21/311;H01L21/316 主分类号 H01L21/3105
代理机构 代理人
主权项
地址