发明名称 |
METODO PER LA FORMAZIONE DI BUMP IN SUBSTRATI CON THROUGH VIA |
摘要 |
<p>A method for manufacturing solder bumps for through vias in a substrate having a first surface and a second surface opposed to each other. The method includes the steps of forming a blind hole extending in the substrate from the first surface for each via and filling each blind hole with a conductive filler; a deepest part of each filler includes a bump portion made of a solder material. The method further includes the step of removing a part of the substrate extending from the second surface to have at least the bump portions protrude from the substrate. The non-protruding part of each filler defines the corresponding via and the bump portion defines the corresponding bump.</p> |
申请公布号 |
ITMI20081505(A1) |
申请公布日期 |
2010.02.09 |
申请号 |
IT2008MI01505 |
申请日期 |
2008.08.08 |
申请人 |
POLITECNICO DI MILANO;STMICROELECTRONICS S.R.L. |
发明人 |
CAMPARDO GIOVANNI;LOSAVIO ALDO;PULICI PAOLO;STOPPINO PIER PAOLO;VANALLI GIAN PIETRO |
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