| 摘要 |
<p>PURPOSE: A method and apparatus for transferring a tray is provided to reduce the tray feeding time by transferring directly the empty tray to the cleaning unit. CONSTITUTION: The loading unit(200) elevates the first tray for supplying the resin when molding the semiconductor chip. The loader part(250) transfers the first tray to the molding unit in order to supply resin to the molding unit. The empty second tray is transferred from the molding unit. The unloader(300) unloads the second tray and descends it to the cleaning part for cleaning the second tray.</p> |
